| March 5th, Monday | ||
| 1A | Mobile Communication Systems (Chair: M.Yamaguchi, Chiba University) | |
| 1A-1 | Progress in Cellular Mobile Radio | 1 |
| K.Hirade, Japan Radio Co., Ltd. | ||
| 1A-2 | IMT-2000 (W-CDMA) System and Services | 3 |
| K.Nagata, NTT DoCoMo, Inc. | ||
| 1A-3 | Surface Acoustic Wave Devices for Wireless Local Area Networks | 9 |
| C.C.W.Ruppel1, N.Geng2, A.Waldherr1 & R.Dill1, (1) EPCOS AG, (2) Siemens | ||
| 1B | Active Devices (Chair: C.C.W.Ruppel, EPCOS AG) | |
| 1B-1 | Miniaturization Technology of RF Devices for Mobile Communication Systems | 17 |
| T.Yamada, T.Ishizaki & M.Sakakura, Matsushita Electric Industrial Co. Ltd. | ||
| 1B-2 | RF Transceiver Architectures for W-CDMA Systems Like UMTS: State of the Art and Future Trends | 25 |
| R.Weigel1,2, L.Maurer1, D.Pimingsdorfer2 & A.Springer1, (1) DICE - Danube Integrated Circuit Engineering, (2) University of Linz | ||
| 1B-3 | RF ICs for W-CDMA Mobile Radio | 35 |
| W.Thomann1, J.Fenk2, R.Hagelauer3 & R.Weigel3, (1) DICE GmbH - Danube Integrated Circuit Engineering, (2) Infineon Technologies Munich, (3) University of Linz | ||
| 1B-4 | Silicon Based RF-IC's for Mobile Communication Terminal Applications | 45 |
| N.Suematsu & M.Ono, Mitsubishi Electric Corporation | ||
| 1C | Asia Now (Chair: C.S.Lam, Vectron International) | |
| 1C-1 | SAW Devices Activities Including BAW and TFBAR Devices for 21st Century in Korea | 51 |
| K.R.Lee, LG-Innotek | ||
| 1C-2 | SAW and BAW Activities and Mobile Communications in Taiwan | 57 |
| J.P-W. Hou, Quartz Frequency Technology Ltd. | ||
| 1C-3 | The Development of SAW for Mobile Communication Systems in China | 61 |
| Y.Shui & D.Zhang, Nanjing University | ||
| March 6th, Tuesday | ||
| 2A | BAW Devices (1) (Chair: J.P-W.Hou, Quartz Frequency Technology) | |
| 2A-1 | Current Status and Future Trends of Crystal Resonators for Mobile Telecommunication Systems | 69 |
| K.Okamoto & M.Okazaki, Nihon Dempa Kogyo Co., Ltd. | ||
| 2A-2 | High Frequency Quartz Resonators and Filters Operating at Fundamental Mode | 73 |
| O.Ishii & H.Iwata, Toyo Communication Equipment Co.,Ltd. | ||
| 2A-3 | Miniature VCTCXO for Mobile Communications | 81 |
| H.Sugimoto, T.Suzuki & M.Sato, Tokyo Denpa Co. Ltd. | ||
| 2B | BAW Devices (2) (Chair: M.Okazaki, Nihon Denpa Kogyo) | |
| 2B-1 | Ultra-Stable Crystal Oscillators for Mobile Communications | 89 |
| H.Sekimoto & Y.Watanabe, Tokyo Metropolitan University | ||
| 2B-2 | Piezoelectric Thin Film Resonators and Filters | 93 |
| K.Nakamura & H.Kobayashi, Tohoku University | ||
| 2C | SAW Devices (Chair: K.Hashimoto, Chiba University) | |
| 2C-1 | SAW Filters for 3G Systems: A Quantum Leap in Size and Passive Integration is Ahead | 101 |
| C.Eder, G.Fischerauer, P.Hagn & G.Riha, EPCOS AG | ||
| 2C-2 | Resonator Type IF SAW Filters Using Shear Horizontal Wave | 107 |
| M.Kadota, Murata MFG. Co. Ltd. | ||
| 2C-3 | Linear-Phase IF SAW Devices | 117 |
| B.P.Abbott, S.M.Knapp, S.Krasnikova & L.P.Solie, SAWTEK Inc. | ||
| 2D | RF Passive Devices (Chair: C.Eder, EPCOS AG) | |
| 2D-1 | RF SAW Filters | 125 |
| Y.Satoh1, O.Ikata1, T.Miyashita1 & H.Ohmori2, (1) Fujitsu Laboratories Ltd., (2) Fujitsu Media Devices Ltd. | ||
| 2D-2 | Power Durability of SAW Filters | 133 |
| Y.Ebata, M.Koshino, O.Furukawa & S.Ichikawa, Toshiba DDC Company | ||
| 2D-3 | Recent Dielectric Filter Technology and Relationship with SAW Technology in the Future | 139 |
| J.Hattori, Murata MFG. Co. Ltd. | ||
| 2D-4 | Multi-Chip Module with Bare SAW Device | 145 |
| F.Uchikoba, T.Goi, N.Harada, S.Nakai, TDK Corporation | ||
| March 7th, Wednesday | ||
| 3A | SAW Design-Related Technologies (Chair: B.P.Abbott, SAWTEK) | |
| 3A-1 | Advanced Design Techniques for High Performance IF and RF SAW Filters | 151 |
| M.Solal1, P.B.Benon1, S.Chmaly1, J.Desbois1, M.Doisy1, P.Dufilie2, J.M.Hode1,3, L.Penavaire1, X.Perois1, V.Plessky1 & P.Ventura1, (1) Thales Microsonics, (2) Thales Components and Tubes, (3) Thales Airborne Systems | ||
| 3A-2 | Recent Progress in Modelling and Simulation Technologies of Shear Horizontal Type Surface Acoustic Wave Devices | 169 |
| K.Hashimoto, T.Omori & M.Yamaguchi, Chiba University | ||
| 3A-3 | Recent Progress on SAW Laser Probing | 179 |
| J.V.Knuuttila1, J.Koskela1, J.Saarinen1, M.M.Salomaa1, V.P.Plessky2, L.Kopp2 & P.Dufilie3, (1) Helsinki University of Technology. (2) Thales Microsonics, (3) Thales Components and Tubes | ||
| 3B | Fabrication Technologies (Chair: Y.Ebata, Toshiba) | |
| 3B-1 | SAW Device Assembly Technology | 189 |
| H.Yatsuda, Japan Radio Co., Ltd. | ||
| 3B-2 | Electrical Characteristics of Ceramic SMD Package for SAW Filter | 195 |
| K.Ikeda & C.Makihara, Kyocera Corp. | ||
| 3C | SAW & BAW System Applications (Chair: R.Weigel, University of Linz) | |
| 3C-1 | SAW-Based Signal Processing for High-Speed Spread Spectrum Communications | 205 |
| M.Hikita, C.Takubo & K.Asai, Hitachi Ltd. | ||
| 3C-2 | SAW-Based Wireless Systems | 213 |
| K.Tsubouchi & H.Nakase, Tohoku University | ||
| 3C-3 | BAW- and SAW-based Timing Recovery for Frequency Control Applications | 219 |
| C.S.Lam, Vectron International | ||
| 3D | SAW & BAW Materials (Chair: K.Nakamura, Tohoku University) | |
| 3D-1 | High Frequency SAW Devices Using SiO2/ZnO/Diamond | 227 |
| S.Shikata, H.Nakahata, S.Fujii, A.Hachigo, H.Kitabayashi, Y.Seki, K.Itakura, T.Uemura, H.Toyoda & N.Fujimori, Sumitomo Electric Industries, Ltd. | ||
| 3D-2 | KNbO3 and Super High Coupling Single Crystals for SAW and BAW Devices | 235 |
| K.Yamanouchi1 & H.Odagawa2, (1) Tohoku Institute of Technology, (2) Tohoku University | ||
| 3D-3 | PZT Thin Films for SAW and BAW Devices | 245 |
| T.Omori, K.Hashimoto, & M.Yamaguchi, Chiba University |